Senior Scientist - TSV- and Si-Interposer Technologies (all genders) / Job-ID: 159-1 Jetzt bewerben
Senior Scientist - TSV- and Si-Interposer Technologies (all genders) / Job-ID: 159-1

Senior Scientist - TSV- and Si-Interposer Technologies (all genders) / Job-ID: 159-1

Villach Vollzeit 70000 - 98000 € / Jahr (geschätzt)
Jetzt bewerben
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Auf einen Blick

  • Aufgaben: Lead R&D for cutting-edge silicon interposers and TSV technologies in a cleanroom environment.
  • Arbeitgeber: Join Silicon Austria Labs, a hub for innovative research in advanced packaging technologies.
  • Mitarbeitervorteile: Enjoy flexible work options, training opportunities, and a supportive family-friendly culture.
  • Warum dieser Job: Be at the forefront of technology with diverse challenges and state-of-the-art facilities.
  • GewĂĽnschte Qualifikationen: M.Sc. or higher in relevant fields with 3+ years of cleanroom experience required.
  • Andere Informationen: Relocation support available; competitive salary starting at €70,000 annually.

Das voraussichtliche Gehalt liegt zwischen 70000 - 98000 € pro Jahr.

Your future responsibilities

  • R&D for 2.5 D silicon interposers, TSV technologies and 3D stacking
  • Design, layout and microfabrication of interposers and TSVs
  • Concept development, DOE planning, and characterization
  • Microfabrication and backend processing in cleanroom environment
  • Contributing with backend solutions to different industrial projects
  • Data analysis
  • Technical reporting and scientific dissemination
  • Project management

Your Leadership responsibilities

Your Scientific responsibilities

Your profile

  • M.Sc. (or higher) in physics, microsystems fabrication, power electronics and electronics engineering or relevant industrial experience.
  • Over 3 years of working experience as an integration scientist in cleanroom environment including hands-on experience with TSV processing.
  • In-depth knowledge and hands-on experience with advanced packaging processes such as interposers, chiplets and TSVs.
  • Good understanding of signal and power integrity in interposers.
  • Familiarity with BGA, WLCSP, SiP, MCM, AiP, AoP, SoC design rules.
  • Experience in project management and research funding proposals.
  • Fluent oral and written communication skills in English; knowledge of German is a plus.

Important Facts about SAL

  • Diverse research activities with many technical challenges.
  • State-of-the-art laboratory facilities and equipment.
  • Location in the heart of Europe in Austria – relocation support for non-European nationalities.
  • Internal and external training opportunities for career development.
  • Home office in Austria (max. 40%) and work from anywhere in the European Union possible (< 25%).
  • Family & children friendly – actively shaping the compatibility of family and career.
  • “Vital4SAL” to promote a healthy workplace (e.g. SAL coaching pool, trainings on mental health, physical activities, healthy snacks, 24/7 accident insurance)
  • € 4 per day meal allowance in restaurants or € 2 per working day in supermarkets.
  • Public transport initiative (subsidy for the “Klimaticket”)

This position is subject to the Collective Agreement for employees in non-university research (Research CA) starting in occupational group F (F1 salary = EUR 4.594,- paid 14 times a year) based on 38.5 hours per week). For this position we offer competitive salaries and additional benefits based on your experience and qualifications, starting with a minimum gross salary of EUR 70.000 (annual, based on an All-in contract and bonus).

Become part of Silicon Austria Labs

#J-18808-Ljbffr

Senior Scientist - TSV- and Si-Interposer Technologies (all genders) / Job-ID: 159-1 Arbeitgeber: Photonics Austria

At Silicon Austria Labs, we pride ourselves on being an exceptional employer, offering a dynamic work environment in the heart of Europe, specifically Austria. Our commitment to employee growth is evident through diverse research activities, state-of-the-art facilities, and extensive training opportunities, including support for relocation and flexible working arrangements. We foster a family-friendly culture that prioritizes work-life balance and employee well-being, ensuring that our team members thrive both personally and professionally.
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Kontaktperson:

Photonics Austria HR Team

StudySmarter Bewerbungstipps 🤫

So bekommst du den Job: Senior Scientist - TSV- and Si-Interposer Technologies (all genders) / Job-ID: 159-1

✨Tip Number 1

Make sure to highlight your hands-on experience with TSV processing and advanced packaging processes in your conversations. This is crucial for demonstrating your fit for the role.

✨Tip Number 2

Familiarize yourself with the specific technologies mentioned in the job description, such as BGA, WLCSP, and SiP. Being able to discuss these in detail will show your expertise and enthusiasm.

✨Tip Number 3

Prepare to discuss your project management experience and any research funding proposals you've worked on. This will be key in showcasing your leadership capabilities.

✨Tip Number 4

Since communication skills are emphasized, practice articulating complex technical concepts clearly and concisely. This will help you stand out during interviews.

Diese Fähigkeiten machen dich zur top Bewerber*in für die Stelle: Senior Scientist - TSV- and Si-Interposer Technologies (all genders) / Job-ID: 159-1

R&D in 2.5D silicon interposers
TSV technologies expertise
3D stacking design
Microfabrication techniques
Cleanroom environment experience
Design of Experiments (DOE) planning
Characterization methods
Backend processing knowledge
Data analysis skills
Technical reporting
Scientific dissemination
Project management experience
Integration science expertise
Advanced packaging processes knowledge
Signal and power integrity understanding
BGA, WLCSP, SiP, MCM, AiP, AoP, SoC design rules familiarity
Research funding proposal experience
Fluent English communication skills
German language knowledge (a plus)

Tipps für deine Bewerbung 🫡

Understand the Role: Make sure to thoroughly read the job description for the Senior Scientist position. Highlight the key responsibilities and required qualifications, such as R&D for silicon interposers and TSV technologies, to tailor your application accordingly.

Highlight Relevant Experience: In your CV and cover letter, emphasize your hands-on experience in cleanroom environments and any specific projects related to TSV processing or advanced packaging processes. Use concrete examples to demonstrate your expertise.

Showcase Communication Skills: Since fluent communication in English is essential, ensure that your application is well-written and free of errors. If you have knowledge of German, mention it as a plus, but focus on showcasing your English proficiency.

Tailor Your Application: Customize your cover letter to reflect your understanding of the company's mission and how your background aligns with their diverse research activities. Mention your interest in contributing to industrial projects and your project management experience.

Wie du dich auf ein Vorstellungsgespräch bei Photonics Austria vorbereitest

✨Showcase Your Technical Expertise

Be prepared to discuss your hands-on experience with TSV processing and advanced packaging processes. Highlight specific projects where you applied your knowledge of interposers, chiplets, and signal integrity.

✨Demonstrate Project Management Skills

Share examples of your project management experience, especially in R&D settings. Discuss how you've successfully managed timelines, resources, and team dynamics in previous roles.

✨Communicate Clearly and Effectively

Since fluent communication in English is essential, practice articulating your thoughts clearly. Be ready to explain complex technical concepts in a way that is understandable to non-experts.

✨Prepare for Behavioral Questions

Expect questions about teamwork, problem-solving, and leadership. Use the STAR method (Situation, Task, Action, Result) to structure your responses and provide concrete examples from your past experiences.

Senior Scientist - TSV- and Si-Interposer Technologies (all genders) / Job-ID: 159-1
Photonics Austria Jetzt bewerben
P
  • Senior Scientist - TSV- and Si-Interposer Technologies (all genders) / Job-ID: 159-1

    Villach
    Vollzeit
    70000 - 98000 € / Jahr (geschätzt)
    Jetzt bewerben

    Bewerbungsfrist: 2027-01-09

  • P

    Photonics Austria

    50 - 100
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