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- Aufgaben: Lead IC assembly processes and manage new product introductions from start to finish.
- Arbeitgeber: Join a dynamic team in the semiconductor industry focused on innovation and quality.
- Mitarbeitervorteile: Enjoy a multicultural work environment with opportunities for growth and development.
- Warum dieser Job: Be at the forefront of technology, solving real-world problems and driving efficiency.
- Gewünschte Qualifikationen: Ideal candidates should have a background in engineering and experience in process management.
- Andere Informationen: This role involves collaboration across various teams and offers leadership opportunities.
Das voraussichtliche Gehalt liegt zwischen 48000 - 72000 € pro Jahr.
In order to strengthen our IC Production Backend division, we are recruiting a
IC Assembly Engineer
You will be responsible for subcontracted processes into our Outsourced Semiconductor Assembly & test houses in Asia (OSAT) processing various types of bumping. Your responsibility covers New Products Introductions (NPI) process from feasibility to full deployment into operations. You will manage internal & external changes proposals coming from our OSATs. Your mission extends to innovation from existing and new OSATS including internal communication and process internalization. As project leader, you drive equipment acquisition from suppliers selection to full deployment in production. As Process engineer, you will be responsible for specific processes in our preassembly site such as, but not limited to, Automated Optical Inspection (AOI) & Die sorting.
Your assignment includes:
- Interface with development team and drive to optimized assembly cost / lead time solutions
- New Products deployments on Automated Optical Inspection (AOI) including production monitoring
- Interface with preassembly team and report potential internalization and lessons learned from OSAT experience
- Engineering ramp up support in internal and external production activity
- You will be a leader in cross-functional problem-solving teams for quality and technical related problems
You will work closely with the Development teams, Engineering, Maintenance, Logistics, and Operations in a highly multicultural environment. As a technical leader of cross-functional teams, documentation and presentation of your work results according to EM’s business processes will be an important part of your responsibility. This position offers various and wide responsibilities on an operational as well as on a project-driven level.
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IC Assembly Engineer Arbeitgeber: TN Switzerland
Kontaktperson:
TN Switzerland HR Team
StudySmarter Bewerbungstipps 🤫
So bekommst du den Job: IC Assembly Engineer
✨Tip Number 1
Familiarize yourself with the latest trends and technologies in semiconductor assembly, especially focusing on bumping processes. This knowledge will not only help you during interviews but also demonstrate your passion and commitment to the field.
✨Tip Number 2
Network with professionals in the semiconductor industry, particularly those who work with OSATs. Engaging in conversations with them can provide valuable insights and potentially lead to referrals that could enhance your application.
✨Tip Number 3
Prepare to discuss specific examples of how you've successfully managed projects or led cross-functional teams in the past. Highlighting your leadership skills and problem-solving abilities will be crucial in showcasing your fit for this role.
✨Tip Number 4
Stay updated on the company's recent projects and initiatives in the IC Production Backend division. Being knowledgeable about our current operations will allow you to ask insightful questions during the interview and show your genuine interest in joining our team.
Diese Fähigkeiten machen dich zur top Bewerber*in für die Stelle: IC Assembly Engineer
Tipps für deine Bewerbung 🫡
Understand the Role: Make sure you fully understand the responsibilities and requirements of the IC Assembly Engineer position. Highlight your relevant experience in managing subcontracted processes and working with OSATs in your application.
Tailor Your CV: Customize your CV to reflect your experience with New Product Introductions (NPI), Automated Optical Inspection (AOI), and cross-functional team leadership. Use specific examples that demonstrate your problem-solving skills and technical expertise.
Craft a Compelling Cover Letter: Write a cover letter that connects your background to the job description. Emphasize your ability to interface with development teams and manage internal and external changes, showcasing your leadership in project-driven environments.
Highlight Multicultural Experience: Since the role involves working in a highly multicultural environment, mention any relevant experience you have in diverse teams or international projects. This will show your adaptability and communication skills across cultures.
Wie du dich auf ein Vorstellungsgespräch bei TN Switzerland vorbereitest
✨Understand the IC Assembly Process
Make sure you have a solid grasp of the IC assembly process, especially regarding bumping and Automated Optical Inspection (AOI). Be prepared to discuss your experience with these processes and how you can optimize them.
✨Showcase Your Project Management Skills
As a project leader, you'll need to demonstrate your ability to manage equipment acquisition and deployment. Prepare examples of past projects where you successfully led cross-functional teams and navigated challenges.
✨Highlight Your Communication Abilities
Since this role involves working in a multicultural environment and interfacing with various teams, emphasize your communication skills. Share experiences where you effectively communicated technical information to non-technical stakeholders.
✨Prepare for Problem-Solving Scenarios
Expect to be asked about how you approach problem-solving, particularly in quality and technical issues. Think of specific instances where you identified problems, proposed solutions, and implemented changes successfully.
