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- Aufgaben: Dive into Acoustic and Ultrasound MEMS Systems for innovative applications.
- Arbeitgeber: Join Infineon, a global leader in semiconductor technology, shaping the future of smart systems.
- Mitarbeitervorteile: Flexible working hours and the opportunity to write your Master's thesis.
- Warum dieser Job: Gain hands-on experience in cutting-edge technology while contributing to impactful projects.
- Gewünschte Qualifikationen: Master's student in Electrical Engineering, Physics, or related fields; motivated and eager to learn.
- Andere Informationen: Work independently and collaborate on exciting IC design and MEMS development.
Internship: Rapid Prototyping and Modelling for Ultrasound App (f/m/div)
You are a committed master student from the field of Electrical/Electronic Engineering, Physics, Technical Mathematics, Mechatronics, Information Technology or related technical study branches and are looking for a new exciting student job? Infineon Power & Sensor Systems (PSS) delivers future-oriented solutions to provide cutting-edge data transport and to make tools and systems smarter, smaller, lighter and more energy-efficient. Our team in Villach is looking forward to receiving your application!
In your new role you will:
Tackle the field of Acoustic and Ultrasound MEMS Systems for localization, ranging, and imaging applications, with the goal of exploring existing simulation tools and working on proprietary simulation solutions
Target system demonstrators based on MEMS products and multichannel signal processing platforms, which will allow you to gain experience in hardware design
Improve system models including physical phenomena and electronics based on literature and deducted experiments
Participate and contribute to IC design and simulation as well as MEMS development activities at the edge of current technology in a global semiconductor leader like ours
Further Information
Type of employment: Temporary / Full-time or Part-time (flexible working hours from Monday to Friday between 6 a.m. and 7 p.m.)
Duration: min. 6 months
You successfully meet the requirements, if you are a motivated and committed Master student from the field of Electrical/Electronic Engineering, Physics, Technical Mathematics, Mechatronics, Information Technology or other related technical study branches. You are best equipped for this task if you additionally offer:
Motivated and eager to gain experience and knowledge in the convergence point of different technical areas
Independent way of working
Fluent in English, German is a plus
If desired, this internship can also be a Master’s thesis. If this is the case, please note that the thesis should be written in cooperation with a university.
Please attach the following documents (German or English) to your application:
Motivation letter
CV
Certificate of matriculation at a university
Latest Transcript of records (not older than 6 months)
Highest completed educational certificate (Matura certificate for Bachelor students, Bachelor certificate for Master students)
Reference letter (optional)
This position is subject to the collective agreement for workers and employees in the electrical and electronics industry (full-time), employment group B for bachelor students, employment group D for master students (https://www.feei.at/wp-content/uploads/2023/05/minimum-salaries-white-collar-workers-2024.pdf).
Internship: Rapid Prototyping and Modelling for Ultrasound App (f/m/div) Arbeitgeber: Infineon Technologies Austria AG
Kontaktperson:
Infineon Technologies Austria AG HR Team
StudySmarter Bewerbungstipps 🤫
So bekommst du den Job: Internship: Rapid Prototyping and Modelling for Ultrasound App (f/m/div)
✨Tip Number 1
Make sure to familiarize yourself with the latest trends and technologies in Acoustic and Ultrasound MEMS Systems. This knowledge will not only help you during the interview but also show your genuine interest in the field.
✨Tip Number 2
Network with professionals in the industry, especially those who work at Infineon or in similar fields. Attend relevant workshops or seminars where you can meet potential colleagues and learn more about the company culture.
✨Tip Number 3
Prepare to discuss your previous projects or experiences that relate to hardware design and signal processing. Being able to articulate your hands-on experience will set you apart from other candidates.
✨Tip Number 4
If you're considering this internship as a potential Master's thesis opportunity, think about how you can align your research interests with the work being done at Infineon. This alignment can make your application more appealing.
Diese Fähigkeiten machen dich zur top Bewerber*in für die Stelle: Internship: Rapid Prototyping and Modelling for Ultrasound App (f/m/div)
Tipps für deine Bewerbung 🫡
Understand the Role: Make sure you fully understand the internship role and its requirements. Familiarize yourself with the fields of Acoustic and Ultrasound MEMS Systems, as well as the specific tasks mentioned in the job description.
Craft a Strong Motivation Letter: Your motivation letter should clearly express your enthusiasm for the position and how your background in Electrical/Electronic Engineering or related fields makes you a suitable candidate. Highlight any relevant projects or experiences that align with the internship's focus.
Prepare Your CV: Ensure your CV is up-to-date and tailored to the internship. Include relevant coursework, projects, and skills that demonstrate your capability in areas like hardware design and simulation tools.
Gather Required Documents: Collect all necessary documents such as your certificate of matriculation, latest transcript of records, and educational certificates. If you have a reference letter, include it as well, but make sure all documents are either in German or English.
Wie du dich auf ein Vorstellungsgespräch bei Infineon Technologies Austria AG vorbereitest
✨Show Your Passion for Technology
Make sure to express your enthusiasm for the fields of Electrical/Electronic Engineering and Ultrasound technology. Share any relevant projects or experiences that highlight your commitment to these areas.
✨Demonstrate Your Problem-Solving Skills
Prepare to discuss specific challenges you've faced in your studies or projects, particularly those related to simulation tools or hardware design. Explain how you approached these problems and what solutions you implemented.
✨Highlight Your Independent Work Style
Since the role requires an independent way of working, be ready to provide examples of times when you successfully managed a project or task on your own. This will show that you can thrive in a flexible work environment.
✨Prepare for Technical Questions
Brush up on key concepts related to MEMS systems, signal processing, and IC design. Be prepared to answer technical questions that may arise during the interview, as this will demonstrate your knowledge and readiness for the internship.