h3AI designs the chip. You accelerate its path to production. /h3 pThe next generation of AI infrastructure needs faster, more efficient optical connections, and reliable semiconductor laser sources to power them. /p p25FAB is a Swiss semiconductor company building multi-material photonic chips designed with our own artificial intelligence (AI) platform. AI-driven design is already part of how we develop devices, connecting functional requirements with chip design and manufacturing-aware engineering. /p pOur indium phosphide (InP) laser development is already underway, and we are preparing the next stage of monolithic integration. We are developing laser sources for optical interconnects, including external laser sources (ELS) for co-packaged optics (CPO), with manufacturability and volume production as core design requirements. /p pWe are hiring an experienced process leader to build on this foundation and accelerate process integration, qualification and industrialization. /p pThis is a hands-on leadership role with a clear mission: turn development progress into repeatable processes, qualified devices and a scalable manufacturing pathway. /p h3Why now /h3 pWe have an active development program, an industrial partner ecosystem and a clear ambition to accelerate commercialization. /p pThe next step requires someone who can connect device requirements, cleanroom execution, process data and manufacturing discipline. You will have the authority to shape that transition, and the responsibility to deliver it. /p ul libBuild on existing progress. /b Advance an active InP development program and help bring its next integration milestones to life. /li libConnect AI design with fabrication. /b Translate AI-designed devices into robust processes, and feed authorized experimental results back into design improvement. /li libOwn the industrialization roadmap. /b Shape process development, qualification priorities and the pathway toward volume production. /li libChange the future of AI with people who have done it before. /b Join a team of industry veterans with decades of hands-on experience, and help take real devices from the cleanroom to production. /li libShare in the outcome. /b Competitive Swiss compensation and an equity opportunity, subject to agreed terms. /li /ul h3What you will do /h3 pIn your first 90 days: /p ul liReview the current status of InP development, device requirements and process readiness /li liIdentify the highest-priority gaps between current development and repeatable manufacturing /li liRefine process integration plans, experiments and acceptance criteria /li liStrengthen process documentation, metrology and statistical process control (SPC) /li liLead the next engineering lots and integration trials with the team /li /ul pOver your first year: /p ul liAccelerate InP laser development toward qualified customer samples and production readiness /li liLead process development and execution for planned monolithic integration /li liImprove yield, uniformity, repeatability and reliability /li liResolve process challenges through structured experiments and root-cause analysis /li liWork with design engineers to incorporate process constraints and experimental feedback into our AI-assisted design workflow /li liCoordinate device characterization, packaging interfaces and reliability testing /li liRecruit and mentor a focused InP process team /li /ul h3What you bring /h3 ul liTypically 10+ years of relevant industrial semiconductor process experience, including substantial hands-on cleanroom work /li liDeep expertise in InP and III-V semiconductor laser fabrication /li liExperience taking at least one semiconductor laser product from development into qualification or production /li liStrong skills in experimental design, process integration, failure analysis and yield improvement /li liThe ability to assess existing development, identify what limits progress and execute a practical improvement plan /liliExperience leading technical work while staying closely involved in engineering decisions /li /ul h3Strong advantages /h3 ul liSingle-frequency, distributed feedback (DFB), distributed Bragg reflector (DBR) or tunable semiconductor lasers /li liEtching, passivation, metallization, contacts, facets or optical coatings /li liMonolithic integration of InP laser structures and associated process modules /li liLaser packaging interfaces, optical coupling and external laser source requirements /li liReliability testing, burn-in and qualification planning, including Telcordia GR-468 /li liPiezoelectric thin films such as AlScN, BTO or PZT /li liCPO, optical interconnects or datacenter transceiver programs /li liTransferring processes between development and manufacturing environments /li /ul h3What we offer /h3 ul liCompetitive Swiss compensation and an equity opportunity /li liTechnical ownership within an active InP laser development program /li liA senior leadership role reporting directly to the CEO /li liThe opportunity to connect our own AI design platform with hands-on semiconductor engineering /li liFlexible remote work for design reviews, planning, analysis and coordination, with regular on-site presence in Switzerland as required /li liAn international working environment /li liRelocation and work permit application support, subject to eligibility and applicable approvals /li /ul p25FAB is an equal-opportunity employer. /p pbTell us the function. 25FAB designs the chip. /b /p #J-18808-Ljbffr
Principal InP Process Engineer — CPO Laser Sources
