Engineer R&D Tgv in Wien

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.To enhance our successful R&D Teamin Leoben, Austria, we are looking for a passionateEngineer R&DVerfügen Sie über die richtigen Qualifikationen und Fähigkeiten für diese Stelle Finden Sie es unten heraus und klicken Sie auf "Bewerben", um berücksichtigt zu werden.In your role, you will support the design and development of new products by contributing to key technical activities within R&D projects. You will execute assigned engineering tasks, collaborating with cross-functional teams, and actively evaluating and adopting external technologies when needed to enable successful product development.Develop and optimize Through Glass Via (TGV) formation processes including laser modification and etchingDevelop and optimize Singulation processesEstablish inspection and metrology methods for TGV characterization and singulation qualitySupport downstream processes (seed, plating, CMP, reliability) by ensuring TGV quality meets integration requirementsSupport the technical design and development of new products by executing assigned tasks and contributing to meeting AT&S's performance and quality standardsConduct research activities and perform experiments to support the development of solutions aimed at improving product performance and manufacturing processesAnalyze experimental data and provide input and recommendations to enhance product performance and improve process efficiencyBachelor's or master's degree in Electrical engineering, Materials Science, Chemical Engineering, Mechanical Engineering, Optics/Photonics, or a related field3+ years of experience in laser micro-machining, glass material processing, or semiconductor packaging processes, in R&D or product development rolesPractical experience with laser systems and/or glass wet etching processesBasic understanding of glass mechanical properties, including crack behavior and heat-affected zone controlHands-on experience with analytical tools regarding inspection and metrologyExperience in advanced IC substrates, interposers, or packaging R&D is a plusStrong technical aptitude with willingness to develop problem-solving skills furtherEffective collaboration and communication skillsFluency in EnglishA meaningful role with opportunities for long-term growth in an international environmentChance to actively contribute to AT&S ́ success and to create valueA structured and tailor-made onboarding program along with continual training opportunitiesModern company canteen with freshly prepared meals every dayFree parking spaces and e-charging stationsDiverse health measures and a wide range of employee benefitsAT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. xncubvj The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry ( ), employment group E-F, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.JOLP1_AT