Leoben, AT
Jul 3, 2026
18049
Expert R&D – Substrate & Packaging Industrialization In your role, you will be responsible for the evaluation and transfer of integration approaches for components requiring high-precision alignment within substrate and packaging environments. The role focuses on assessing feasibility under realistic production conditions and contributes to the development and realization of integration approaches. The position contributes to building and validating integration processes through hands‑on experimental work and process development, ensuring that concepts can be translated into stable and scalable solutions.
Your Responsibilities
Evaluate integration approaches for components requiring high-precision alignment within substrate and manufacturing environments
Assess compatibility of proposed approaches with existing process capabilities, materials, and infrastructure
Contribute to the development and realization of integration approaches within prototyping and process development activities
Identify process limitations, critical tolerances, and integration constraints affecting implementation
Support and execute experimental work, including design of experiments (DoE), to validate approaches under realistic conditions
Identify and understand process sensitivities and critical parameters affecting stability and yield
Iteratively refine processes based on experimental results and learnings
Contribute to the identification of required process adaptations, capability gaps, and infrastructure needs
Support internal decision-making by providing feasibility assessments and technical input, participate in internal and external technical discussions related to process integration
Contribute to definition of implementation pathways for new technologies
Your profile
Bachelor’s or Master’s degree in Engineering, Materials Science, Electronics, or a related technical field
Several years (typically 5+ years) of experience in substrate, PCB, or advanced packaging manufacturing or process development environments
Experience working across R&D, engineering, experimental work and design of experiments (DoE), and production interfaces in a collaborative environment
Experience in IC substrate manufacturing, HDI technologies, integration or prototyping is an advantage
Strong understanding of manufacturing and assembly processes in substrate or packaging environments
Ability to translate technical concepts into feasible and stable process solutions under real production conditions
Understanding of process sensitivities, tolerances, and material interactions in high-precision assemblies
Structured, hands‑on, and solution‑oriented way of working with a focus on implementation
Fluency in English
Our Offer
A meaningful role with opportunities for long‑term growth in an international environment
Chance to actively contribute to AT&S´ success and to create value
A structured and tailor‑made onboarding program along with continual training opportunities
Modern company canteen with freshly prepared meals every day
Free parking spaces and e‑charging stations
Diverse health measures and a wide range of employee benefits
AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths.
The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry, employment group H, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.
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Jul 3, 2026
18049
Expert R&D – Substrate & Packaging Industrialization In your role, you will be responsible for the evaluation and transfer of integration approaches for components requiring high-precision alignment within substrate and packaging environments. The role focuses on assessing feasibility under realistic production conditions and contributes to the development and realization of integration approaches. The position contributes to building and validating integration processes through hands‑on experimental work and process development, ensuring that concepts can be translated into stable and scalable solutions.
Your Responsibilities
Evaluate integration approaches for components requiring high-precision alignment within substrate and manufacturing environments
Assess compatibility of proposed approaches with existing process capabilities, materials, and infrastructure
Contribute to the development and realization of integration approaches within prototyping and process development activities
Identify process limitations, critical tolerances, and integration constraints affecting implementation
Support and execute experimental work, including design of experiments (DoE), to validate approaches under realistic conditions
Identify and understand process sensitivities and critical parameters affecting stability and yield
Iteratively refine processes based on experimental results and learnings
Contribute to the identification of required process adaptations, capability gaps, and infrastructure needs
Support internal decision-making by providing feasibility assessments and technical input, participate in internal and external technical discussions related to process integration
Contribute to definition of implementation pathways for new technologies
Your profile
Bachelor’s or Master’s degree in Engineering, Materials Science, Electronics, or a related technical field
Several years (typically 5+ years) of experience in substrate, PCB, or advanced packaging manufacturing or process development environments
Experience working across R&D, engineering, experimental work and design of experiments (DoE), and production interfaces in a collaborative environment
Experience in IC substrate manufacturing, HDI technologies, integration or prototyping is an advantage
Strong understanding of manufacturing and assembly processes in substrate or packaging environments
Ability to translate technical concepts into feasible and stable process solutions under real production conditions
Understanding of process sensitivities, tolerances, and material interactions in high-precision assemblies
Structured, hands‑on, and solution‑oriented way of working with a focus on implementation
Fluency in English
Our Offer
A meaningful role with opportunities for long‑term growth in an international environment
Chance to actively contribute to AT&S´ success and to create value
A structured and tailor‑made onboarding program along with continual training opportunities
Modern company canteen with freshly prepared meals every day
Free parking spaces and e‑charging stations
Diverse health measures and a wide range of employee benefits
AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths.
The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry, employment group H, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.
#J-18808-Ljbffr
Expert - Substrate & Packaging Industrialization Arbeitgeber: AT&S
Als IT Network Architect (F/M/D) in unserem Unternehmen profitieren Sie von einer dynamischen Arbeitsumgebung, die Innovation und Zusammenarbeit fördert. Wir bieten Ihnen nicht nur ein wettbewerbsfähiges Gehalt von 70.000 € jährlich, sondern auch umfangreiche Weiterbildungsmöglichkeiten und eine Kultur, die persönliches Wachstum und Teamarbeit schätzt. Unsere zentrale Lage ermöglicht es Ihnen, in einem inspirierenden Umfeld zu arbeiten, das den Austausch von Ideen und kreativen Lösungen unterstützt.
