Overview
In this role you will drive the development of next-generation build-up technologies for Glass Core Substrates, shaping the technology roadmap and enabling high-performance packaging. You will work with internal and external partners to industrialize advanced substrate solutions and tackle reliability, yield, and manufacturability challenges. You will lead technical programs and influence development strategy in a collaborative, international environment. This is a chance to contribute to cutting-edge semiconductor substrates that power complex devices.
Leistungen / Benefits
- structured onboarding program
- continual training opportunities
- modern company canteen
- free parking spaces
- e-charging stations
- diverse health measures and employee benefits
Verantwortungsbereiche
- Lead development of build-up technologies for Glass Core Substrate applications
- Optimize process technologies: glass handling, temporary support systems, dielectric lamination, via formation, metallization, lithography, etching, plating
- Define integration strategies to meet electrical, mechanical, yield, and manufacturability targets
- Create roadmaps for build-up structures and next-generation Glass Core Substrates
- Develop handling concepts to minimize glass damage, warpage, and defects
- Resolve material interaction, dimensional stability, process variation, and reliability issues
- Lead root cause analyses and implement corrective actions
- Collaborate with material suppliers, equipment vendors, and cross-functional teams
- Provide technical leadership for development programs, IP generation, and technology transfer
Zentrale Anforderungen
- 10+ years in substrate, PCB, semiconductor packaging, or related process technology development
- Strong expertise in build-up processes including dielectric lamination, via formation, metallization, lithography, etching, plating
- Experience in process integration and technology development for high-density interconnect and advanced substrate applications
- Knowledge of glass handling, temporary carrier systems, thin substrate processing, and defect control
- Strong understanding of electrical and thermo-mechanical reliability requirements for advanced substrate technologies
- Experience in process optimization, yield improvement, root cause analysis, and reliability enhancement
- Proven ability to lead complex technical projects and drive cross-functional collaboration
- Strong communication and problem-solving skills with ability to influence technical direction and development strategy
- Fluency in English
- strong communication
- problem-solving
- influence technical direction
- dielectric lamination
- via formation
- metallization
Principal Engineer R&D - Build-up Process in Leoben Arbeitgeber: AT&S
Als IT Network Architect (F/M/D) in unserem Unternehmen profitieren Sie von einer dynamischen Arbeitsumgebung, die Innovation und Zusammenarbeit fördert. Wir bieten Ihnen nicht nur ein wettbewerbsfähiges Gehalt von 70.000 € jährlich, sondern auch umfangreiche Weiterbildungsmöglichkeiten und eine Kultur, die persönliches Wachstum und Teamarbeit schätzt. Unsere zentrale Lage ermöglicht es Ihnen, in einem inspirierenden Umfeld zu arbeiten, das den Austausch von Ideen und kreativen Lösungen unterstützt.
