Besi is a global leader in semiconductor equipment for advanced packaging, supplying the die and wafer bonding systems used to build the next generation of chips. Our high accuracy thermocompression bonders are used by leading semiconductor manufacturers worldwide to create the ultra-fine-pitch interconnects behind today's most advanced devices 6 the technology underpinning 2.5D/3D integration and chiplet-based packaging.
As an intern in our systems engineering team, you will work directly on our production bonding equipment, contributing to test and development work on the same systems supplied to our customers.
Your area of impact
- Design and run test campaigns to characterize heater-cooler system performance 6 thermal response, stability and repeatability 6 on a high-accuracy bonding machine - Evaluate bonding system thermomechanical performance and wear under realistic thermocompression bonding conditions - Build test automation scripts and data pipelines in Python - Analyze test data, identify performance bottlenecks, and propose concrete improvements to the system or the test methodology - Work with the engineering team to implement and validate the improvements you identify - Depending on interest and progress, extend into adjacent areas: machine vision for process monitoring, material pairing studies, or tribological coatings for toolholders
What makes you successful
- Completed bachelor study and enrolled or planning to enroll in a master 2 program in Mechanical Engineering, Materials Science, Physics or a related field - A logical, analytical approach to problem-solving - comfortable structuring a design of experiments, forming and testing hypotheses, and using data to verify or disprove assumptions - Fluency in Python for test automation and data analysis - Willingness to learn how closed-loop control systems work 6 thermal control, motion control, sensor feedback - Genuine interest in materials science 6 the thermal, mechanical and surface behavior of real components - Fluency in English is essential; German is a plus
What we offer:
- Exciting challenges in an innovative high-tech environment - International collaboration with technology, production, and supplier sites worldwide - Contributions to Reka Checks, Faboo, and Green Benefits - and much more!
Industrial Internship System Engineering, Semiconductor Advanced Packaging in Steinhausen Arbeitgeber: Besi Switzerland AG
Besi Switzerland AG bietet als Arbeitgeber ein dynamisches und innovatives Arbeitsumfeld, in dem Software Engineers die Möglichkeit haben, an hochpräzisen Anwendungen im Bereich der Halbleiterindustrie zu arbeiten. Mit flexiblen Arbeitszeiten, attraktiven Mitarbeiter-Erfolgsbeteiligungen und internationalen Zusammenarbeit fördert das Unternehmen nicht nur die persönliche und berufliche Entwicklung seiner Mitarbeiter, sondern auch eine Kultur der Innovation und des Teamgeists. Die Nutzung modernster AI-Werkzeuge und die aktive Teilnahme an interdisziplinären Projekten machen Besi zu einem herausragenden Arbeitgeber für technologiebegeisterte Talente.
