Senior Equipment Hook-Up Engineer (m/f/d)

European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting‑edge manufacturing technologies for next‑generation semiconductor products. ESMC represents a shared commitment to strengthening the European semiconductor ecosystem.

Senior Equipment Hook‑Up Engineer (m/f/d)

As a Senior Equipment Hook‑Up Engineer, you will coordinate all hook‑up activities from planning, construction, and commissioning of faculty media supplies (gases, chemicals, exhaust air, ultra‑pure water, wastewater, electricity) from the base build supply connection to the process equipment at our new state‑of‑the‑art semiconductor fab in Dresden.

Job Responsibilities

• Become part of the facility team to build ESMC's 300mm semiconductor fab.
• Develop and manage detailed schedules for equipment hookups, coordinating with equipment vendors, construction teams, contract vendor management, and facility engineers to ensure seamless integration in compliance with environmental and safety regulations.
• Review and approve hookup designs and engineering plans, ensuring compliance with industry standards and project specifications. Experience in electrical, process colling water, ultra‑pure water, Gas & Chemical, and other Plastic utility systems.
• Monitor and report on the progress of hookup activities to senior management, addressing any issues or delays proactively.
• Support system design, construction, and commissioning for new facility installations and upgrades.
• Plan, coordinate, and execute strategies to accelerate hookup progress. Identify opportunities for cost savings, reliability improvements, and integration of best practices.
• Lead a team of technicians and contractors, providing guidance, training, and performance evaluations.

Job Qualifications

• Degree in Electrical, Chemical, Mechanical or Automation Engineering or a related field.

Must Have Experience

• 10+ years of experience in equipment hookup or facility engineering within the semiconductor industry.
• Proven track record in managing large‑scale construction or installation projects.
• Familiarity with semiconductor fabrication processes and equipment.

Language Skills

• Fluent in German and English.

Professional Skills

• Proficient with Microsoft Office, discipline‑specific software (i.e., AutoCAD, Revit, etc.).

Personal Attributes

• Strong problem‑solving, analytical thinking, highly effective interpersonal and communication skills when interacting with others.

Location: Dresden, Germany.

It is the policy of ESMC to provide equal employment opportunity (EEO) to all persons regardless of age, color, ethnic and national origin, citizenship status, physical or mental disability, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, genetic information, marital status, status with regard to public assistance, veteran status, or any other characteristic protected by federal, state or local law.