Wafer Test Engineer (m/f/d)

For our client, a leading global technology company in the semiconductor industry, we are looking for a Wafer Test Engineer (m/f/d) in Böblingen.

About the Role

We are looking for an experienced Wafer Test Engineer to support an innovative semiconductor testing project focused on next-generation optical wafer contacting technology.

This role combines semiconductor test engineering, precision mechanics, optical measurement technology, and equipment integration in a cleanroom environment.

• Your Responsibilities
• Operate, maintain, and modify wafer probing and semiconductor test equipment.
• Perform wafer-level electrical testing at the beginning of the semiconductor test flow (after wafer fabrication/lithography and before wafer dicing).
• Set up, calibrate, troubleshoot, and optimize wafer probe systems and automated test equipment.
• Work with wafer probe cards, needle/pin contacting systems, and support the transition to optical laser-based wafer contacting technologies.
• Operate and maintain high-precision optical measurement equipment, including lasers, power meters, and micron‑level (µm) 3D positioning systems.
• Perform mechanical modifications, adjustments, maintenance, and upgrades on wafer probers and test systems.
• Analyze test results and support continuous process improvements.
• Collaborate closely with engineering, production, and manufacturing teams.
• Work in cleanroom environments while following cleanroom procedures and quality standards.
• Required Qualifications
• Degree or technical qualification in Electrical Engineering, Electronics, Mechatronics, Physics, Semiconductor Technology, or a related field.
• Practical experience in semiconductor testing, ideally at the beginning of the test chain, including wafer‑level testing after wafer lithography and before chip singulation.

• Hands‑on experience operating wafer probers such as

• TEL (Tokyo Electron)
• Accretech
• Semics
• Fiontec
• or comparable wafer probe systems.
• Experience working with
• V93000 automated test equipment (ATE) is highly preferred. Experience with
• Teradyne

ATE platforms (e. g. Ultra FLEX, Ultra FLEXplus, J750, FLEX) is also considered an advantage.

• Good understanding of probe cards, wafer contacting, and wafer probing technologies.
• Basic knowledge of electrical engineering and electronic circuits. Circuit troubleshooting experience is beneficial; PCB design experience is not required.
• Strong mechanical aptitude and hands‑on mindset with the ability to perform equipment modifications, hardware adjustments, maintenance, and troubleshooting.

We are looking for someone who enjoys working directly on equipment rather than purely theoretical engineering tasks.

• Experience working in cleanroom environments.
• Good Microsoft Office skills.
• Fluent English, German is a plus.
• Preferred Qualifications
• Experience with optical measurement systems.
• Knowledge of laser technology, power meters, and optical instrumentation.
• Experience with high‑precision 3D positioning systems in the micrometer (µm) range.
• Experience transitioning from conventional needle/pin wafer contacting to optical measurement technologies.
• Automotive semiconductor manufacturing experience (e. g. Bosch Semiconductor or similar companies).
• Our Offer to You
• Permanent employment at Nash direct, initially for 15 months with option to be hired directly through our client Advantest Europe Gmb H.
• An exciting environment and cutting‑edge projects at global brands and hidden champions.
• Personal and individual support by our Account Managers and HR team.
• Be part of the Nash direct team and connect with your colleagues throughout Germany.
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