Senior Layout Engineer in Zürich

Zürich, SwitzerlandSeniority: 5+ years (custom analog/SRAM/custom-digital layout) Own transistor-level and block-level custom layout for mixed-signal, SRAM, and custom-digital IP that powers our compute-in-memory SRAM (ComputeRAM). You will plan floorplans, implement device-level layouts with production-grade matching/guarding, close DRC/LVS/PEX on advanced nodes down to 4 nm and below, and collaborate tightly with custom-design, digital, and PD/STA teams to hit aggressive PPA, yield, and reliability targets. You will bridge classic analog techniques (common-centroid/interdigitation, shielding, isolation) with FinFET/FDSOI rules, multi-patterning/EUV constraints, and modern DFM practices. What you’ll do Plan & implement full-custom layouts for standard cells, custom datapaths, and SRAM periphery/arrays. Drive and provide feedback to the design team to converge on the most power-aware design layout possible. Interface & integrate: align with schematic owners on constraints; define pins/abstracts, LEF views, keep-outs, and tiling for memory-like macros; coordinate with MBIST/scan wrappers and test hooks. Automate & document: maintain checklists, templates, and layout guidelines; script repetitive tasks (TCL, Python) Outcomes (first 18 months) Tape-in and silicon of one or more custom blocks or macros with clean DRC/LVS/PEX and correlated post-silicon parasitics (report + lessons-learned). Requirements 5+ years in custom layout for analog/SRAM/custom-digital IP; strong ownership from floorplan to sign-off. Demonstrated quality on sub-28 nm nodes; practical know-how for FinFET/FDSOI, multi-patterning/EUV constraints, coloring. Solid analog layout techniques: common-centroid, interdigitation, current-mirror symmetry, matched routing, shielding/guard rings, substrate noise isolation. Working grasp of timing/IR/EM implications of layout; ability to read extraction/timing reports and iterate with designers/PD/STA. Clear communication, rigorous documentation, and a collaboration mindset across custom design, digital, and backend teams. Nice to have Experience with SRAM arrays/periphery, redundancy/repair hooks, MBIST/scan routing constraints. TCL/Python for layout automation and report generation. DFM/DFY exposure ESD/latch-up design practice; EM/IR sign-off collaboration at the macro level. Comfort producing LEF and working with integration/floorplanning teams on macro delivery. Interview flow (indicative) 30-min intro with HR (role/context) First Technical deep dive Second Technical Deep Dive (Optional) Third Technical Deep Dive Systems/product conversation with management #J-18808-Ljbffr