Engineer Package Technology ( Contract )

Perform design and drafting drawing and specification for package and lead frame based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.

Your Role

Key responsibilities in your new role

• Use of AutoCAD and Inventor tool in package development cycle. Understanding design systematics, creating 3D models and parametric control.
• Use of CAD Desktop and SAP in Inventor use case, understanding the interactions between Inventor and SAP through CAD Desktop as well as Metadata, revisioning, file linkages, and derivations.
• Design method and design flow of new package and leadframe based on technical capabilities of materials, processes and suppliers.
• Modified 2D and 3D output.
• Drive Package / leadframe 3D design development activities and ensure fulfilment of project milestone deliverables and documentation release (spec, drawing, SAP)
• Liaise with leadframe engineer to ensure fulfilment of all leadframe specification and requirement.

Your Profile

Qualifications and skills to help you succeed

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• Preferably fresh graduate / Junior with in-depth AutoCAD 2D and AutoDESK Inventor 3D Skills
  Drafting / designing (2D/3D) Lead Frame using AutoCAD / Inventor.
• Drafting / designing (2D/3D) semiconductor package (Mold Body, Wire, Chip, Solder & etc) using AutoCAD / Inventor.
• GD&T knowledge / material specification definition.
• Strong mathematic knowledge (Algebra, trigonometry & etc) for Inventor parametric.
• Analytical and problem solving skills.

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