Lead Principal Engineer Package Concept Engineering (m/w/div)

#WeAreIn for jobs that impact everyone’s life. What if your ideas could change the way the world connects, powers up, or thinks?As a Lead Principal Engineer Package Concept Engineering (m/w/div) on our Research & Development team, you’ll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your Role

Key responsibilities in your new role

• Develop package concepts for IBC (Intermediate Bus Converter) modules targeting high efficiency and power density for hyperscale datacenters and AI servers
• Evaluate and validate packaging / module concepts through simulation and hardware demonstrators, working closely with Backend Development, Product Development and System Architects
• Initiate new ideas, concepts in collaboration with internal and external partners
• Trigger Package / Module Projects with development partners at inhouse or OSAT manufacturing sites. Support and follow up on development projects through to final product release
• Define a Packaging Roadmap for IBC Modules and derive the necessary innovation and pre-development activities, to assume right-fit capabilities for future needs
• Provide consultation to customers on packaging-specific questions and continuously conduct market and competitor analyses to identify new business opportunities and understanding cost positioning

Your Profile

Qualifications and skills to help you succeed

• With your strong communication skills and solution-oriented thinking, you successfully drive innovation and execution as part of an interdisciplinary global team
• A technical background through a degree in e.g. Mechanical, Electronics or Physics
• Extensive practical experience in assembly technologies with detailed knowledge of Back-End and/or EMS processes and materials
• Deep understanding of concept & application dependencies influencing laminate design, materials and processes, to assess HW and Thermal Management aspects
• Ideally with background knowledge of SMT related technologies
• Experience with typical package design tools (e.g. AutoCAD/ Cadence)
• Proven ability to solve problems with higher complexity by pro-actively involving expert networks
• Occasional willingness to travel to customers and vendors with good communication and presentation skills in English and German

Contact:
Nicola Weihofer Senior Specialist Recruiting

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.
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