Trim and Form / Dejunk / Tie bar cut/ Lead Cut process know-how.
Your Role
Key responsibilities in your new role
1. Trim and Form / Dejunk / Tie bar cut/ Lead Cut process know-how.
2. Understand Equipment specifications, tooling design, process documentation(control plan, FMEA, OJTI), failure catalogues.
3. Tooling Design Rules ,Collaborate with R&D to design experiments, analyze results, and improve yield/performance.
4. Optimize Trim Form processes for advanced semiconductor packaging(e.g., lead frame-based devices).Troubleshoot process issues and implement corrective actions.
5. Support cross-functional teams in product launches and technology transfers.
Your Profile
Qualifications and skills to help you succeed
1.Bachelor’s/Master’s in Engineering (Materials, Mechanical, or Electrical).
2. 5+ years in semiconductor packaging or related fields.
3. Experience with Trim Form equipment and materials. Strong analytical skills and familiarity with DOE.
4. Strong knowledge of FMEA, SPC, lean-six sigma and other statistical tools ,Be able to use statistic tools for problem solving and further process improvement
5. Fluent communication both in Chinese and English.
Contact:
Alice.Shi-EE@infineon.cn, LinkedIn
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
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Kontaktperson:
Infineon Technologies Austria AG HR Team