Senior Staff Engineer Assembly Engineering

Technical Resource and Support for Operations Engineering

Your Role

Key responsibilities in your new role

• Technical Resource and Support for Operations Engineering
• Subject Matter expertise in back-End assembly for SMT packages (QFN,TDSON, BGA, Multi-Chip Module, WLCSP, C hip Embedding, etc.)
• Technical Resource and Support for Operations Engineering
• Subject Matter expertise in back-End assembly for SMT packages (QFN,TDSON, BGA, Multi-Chip Module, WLCSP, C hip Embedding, etc.)
• Be a crucial part in optimizing non-standard package processes, collaborating with cross-functional teams, and supporting the rapid ramp-up and release of AI products.
• Develop and execute strategic plans to achieve operational excellence in OSAT operations.
• Be responsible for driving the development and implementation of roadmaps for Outsourced Semiconductor Assembly and Test (OSAT) operations, with a focus on key performance indicators (KPIs) such as yield, quality, and overall equipment effectiveness (OEE).
• Collaborate with multi-functional teams to support AI product development and launch
• Provide technical leadership and guidance to ensure successful product ramp-up and continuous sustaining/ improving for mass production

Your Profile

Qualifications and skills to help you succeed

• Intensive and hands on experience in Back-End assembly operations and specialized on key SMT processes
• 10+ years\‘ experiences in at least BE assembly process and test engineering with good quality management/ mindset in semiconductor backend or substrate manufacturing industry,
• Strong knowledge and patience to deal with production sustaining, process development/ optimization and yield improvement
• Strong data analysis and problem-solving skills. (Spotfire, JMP and etc. software in middle to expert level skills is required)
• Good understanding of VDA6.3, IATF16949, APQP, FMEA, DOE, SPC, 8D and other QC tools
• Good communication skills, willing and able to work in multi-function environment to provide hands on result with considering win-win result oriented outcomes
• External manufacturing management skillsets to provide effectives management skill on OSAT management and communication to drive efficient actions in short lead time
• Good learning curve and curiosity, always keep in fresh eye to drive continuous improvement and take new challenges/ knowledge as opportunities to drive for improvement
• Willing to do high frequency on-site traveling (>70% on-site per year is required)
• Chip Embedded package experiences is a plus
• Degrees in Electronic Engineering, Mechanical Engineering, Material or Chemical Science preferred

#WeAreIn for driving decarbonization and digitalization.
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