Auf einen Blick
- Aufgaben: Lead technical definition and design for innovative packaging projects.
- Unternehmen: Join Infineon, a global leader in semiconductor solutions driving green energy and IoT.
- Vorteile: Enjoy a diverse and inclusive work environment with opportunities for growth and innovation.
- Weitere Informationen: We value diversity and encourage applicants from all backgrounds.
- Warum dieser Job: Be at the forefront of technology, making life easier, safer, and greener.
- Qualifikationen: Bachelor’s in Engineering with 7+ years in semiconductor packaging and design.
Das prognostizierte Gehalt liegt zwischen 54000 - 84000 € pro Jahr.
Your Role
Key responsibilities in your new role
- Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc) activities for package projects with major changes/new package, risks and impact.
- Generate conceptual package outline and internal construction drawings, finalise and document the drawings and update the package drawings as needed..
- Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
- Coordinate the package Cost Estimation (A1-A3) and Cost Indication(A3).
- Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
- Support pre development & project definition stage, and continue tobe package design expert throughout project phase.
Your Profile
Qualifications and skills to help you succeed
- Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 7 years of relevant working experience in IC/semiconductor environment/SMT.
- Knowledge in SMT, Semiconductor Packaging, Assembly and Test.
- Process and Equipment Engineering knowledge.
- Knowledge in Failure Analysis and Reliability Engineering.
- Knowledge in Analytical and Problem Solving Skills.
- AutoCAD and 3D drafting knowledge preferred.
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Senior Staff Engineer Package Technology Arbeitgeber: Infineon Technologies Austria AG
Infineon ist ein hervorragender Arbeitgeber, der seinen Mitarbeitern nicht nur ein inspirierendes Arbeitsumfeld bietet, sondern auch vielfältige Möglichkeiten zur persönlichen und beruflichen Weiterentwicklung. Mit einem starken Fokus auf Innovation und Nachhaltigkeit in der Halbleitertechnologie fördert das Unternehmen eine Kultur der Offenheit und des Respekts, in der Vielfalt geschätzt wird. Die Lage in einer dynamischen Region ermöglicht es den Mitarbeitern, Teil eines globalen Netzwerks zu sein, das an der Spitze der technologischen Entwicklung steht.
Kontaktdaten:
Infineon Technologies Austria AG Recruiting-Team
StudySmarter Expertenrat🤫
Wir sind der Meinung, dass Sie so Senior Staff Engineer Package Technology erhalten könnten
✨Tip Number 1
Make sure to showcase your extensive experience in semiconductor packaging and assembly during the interview. Highlight specific projects where you drove innovation or overcame challenges, as this will demonstrate your capability to handle major changes and new packages.
✨Tip Number 2
Familiarize yourself with the latest trends in packaging technologies. Being able to discuss recent advancements or competitors' developments can position you as a knowledgeable candidate who is proactive about staying ahead in the field.
✨Tip Number 3
Prepare to discuss your experience with AutoCAD and 3D drafting in detail. Be ready to explain how you've used these tools in past projects to create conceptual package outlines and internal construction drawings.
✨Tip Number 4
Emphasize your analytical and problem-solving skills by preparing examples of how you've tackled complex issues in previous roles. This will help illustrate your ability to meet electrical, thermal, reliability, and mechanical requirements effectively.
Wir glauben, dass du diese Fähigkeiten brauchst, um Senior Staff Engineer Package Technology mit Bravour zu bestehen
Einige Tipps für deine Bewerbung 🫡
Understand the Role:Make sure you fully understand the responsibilities and requirements of the Senior Staff Engineer Package Technology position. Tailor your application to highlight your relevant experience in semiconductor packaging, assembly technology, and project management.
Highlight Relevant Experience:In your CV and cover letter, emphasize your 7+ years of experience in the IC/semiconductor environment. Include specific examples of projects where you drove technical definitions, package designs, or innovations in packaging technologies.
Showcase Technical Skills:Clearly outline your technical skills related to AutoCAD, 3D drafting, and any other relevant engineering tools. Mention your knowledge in failure analysis, reliability engineering, and process engineering to demonstrate your expertise.
Express Your Passion for Innovation:Convey your enthusiasm for scouting new packaging technologies and driving innovation within the package platform. Share any personal projects or experiences that reflect your commitment to advancing semiconductor solutions.
Wie man sich auf ein Vorstellungsgespräch bei Infineon Technologies Austria AG vorbereitet
✨Showcase Your Technical Expertise
Be prepared to discuss your experience in semiconductor packaging and assembly. Highlight specific projects where you defined package characteristics or led technical definitions, as this will demonstrate your capability to handle the responsibilities of the role.
✨Demonstrate Problem-Solving Skills
Prepare examples of how you've tackled complex engineering challenges in the past. Discuss your analytical approach and any innovative solutions you implemented, especially in relation to reliability engineering or failure analysis.
✨Familiarize Yourself with Current Technologies
Stay updated on the latest packaging technologies and trends in the semiconductor industry. Be ready to discuss how these advancements could impact the company's projects and how you can contribute to scouting for new technologies.
✨Communicate Effectively
As a potential contact partner and consultant, strong communication skills are essential. Practice articulating your thoughts clearly and concisely, especially when discussing technical concepts or collaborating with cross-functional teams.
