Senior Staff Engineer Unit Process Development Material

To drive Lead Frame / Packing Material development activities to ensure the package fulfil all requirement in the aspect of manufacturing, product qualification and reliability

Your role
Key responsibilities in your new role

1. To drive Lead Frame / Packing Material development activities to ensure the package fulfil all requirement in the aspect of manufacturing, product qualification and reliability
2. Technical expert for lead frame / packing material (mold compound, epoxy, solder paste, wires) in package development projects
3. Perform design, drawing and specification for lead frame/packing material based on design guideline, assembly rules and ensure design for manufacturing, quality and cost
4. Collaborate with internal and material supplier on packing material design, specification and selection; and ensure design for manufacturing, quality and cost
5. Drive lead frame / packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc)
6. Liaise with SQM and supplier to ensure fulfilment of quality requirement / FAI for lead frame/ packing material; and qualification release
7. Establish design guideline / requirement for lead frame / packing material specification
8. Actively engages with lead frame / packing material suppliers to explore new technology, best in cost design, etc to achieve competitive advantages
9. Generate technical papers / journals and patents related to lead frame / package design that enhances technical value

Your profile
Qualifications and skills to help you succeed

1. Bachelor or Master’s Degree in Mechanical, Electrical or Electronics Engineering, Material Science, Metallurgical Engineering or a related discipline
2. At least 5 years of working experience in semiconductor packaging. Prior experience in SON, DSC, TO, DSO power product development is strongly preferred
3. A structured and analytical mindset with a proven ability to drive complex topics independently from analysis to implementation
4. Good aptitude for communication, collaboration, negotiation and solution finding
5. Knowledge in material physics / properties for Lead Frame / substrates (DCB/AMB) and packing material (mold compound, epoxy glue, solder paste, WB wires, copper clip)
6. Basic knowledge about semiconductor packaging, assembly and test
7. Statistical data analysis, analytical and problem solving skills, e.g. 8D, DMAIC
8. Competent in daily oral & written English for cross-functional and overseas communication
9. Project management experience is a benefit

#WeAreIn for driving decarbonization and digitalization.
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