Auf einen Blick
- Aufgaben: Lead package platform qualification and optimize processes for top-notch product quality.
- Unternehmen: Join Infineon, a leader in semiconductor solutions for automotive, industrial, and consumer markets.
- Vorteile: Enjoy a diverse and inclusive work environment with equal opportunities for all.
- Weitere Informationen: Strong communication skills and experience in Subcon management are essential.
- Warum dieser Job: Be part of innovative projects that drive decarbonization and digitalization in technology.
- Qualifikationen: Master's or Bachelor's in Engineering with 7+ years in package development required.
Das prognostizierte Gehalt liegt zwischen 72000 - 84000 € pro Jahr.
Key responsibilities in your new role
- Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time-to-market, product quality level, process capability and assembly yield target
- Responsible for package definition tasks in OSAT segment in defining project complexity definition with Delta assessment list, project category assessment, and perform project risk assessment with mitigation actions
- Responsible for integration of unit processes till process freeze for assembly and test at subcons which entails creating assembly specification, marking instruction, and packing specification for upload into Database
- Apply and verify design rules based on established baseline document as well as specific equipment and process capability of specific assembly sites. This includes OSATs technical capability assessment support role
- Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre-development
- Responsible for enabling of new package platform and derivatives packages, and support of technology and package development at OSAT. This includes new subcon enabling support role
- As a driver or co-driver for platform related Task force activities, and has ability to drive for technical problem-solving
Your Profile
Qualifications and skills to help you succeed
- Master or Bachelor degree in Engineering disciplines
- Minimum 10 years’ working experience of package development in new product introduction or process (Pre-assembly, assembly and test) and 3 years in supporting project management
- Experience in Module assembly, Wafer level package (WLP), bumping, eWLB, and System in Package (SiP) will be a key advantage
- Good knowledge of process and material in both laminates and lead frame packages and interaction to the different functions (laminate/lead frame design, design rules, process)
- Good understanding of quality requirements/release criteria (e.g JEDEC/AEC grade) that fits and match to product/package design and BOM sets selection
- Strong analytical skills, ability to deal with conflict. Live up to high quality standards. Good quality mind-set and excellent problem-solving
- Demonstrates active knowledge transfer and best practice sharing across organizational boundaries, be ambitious and ability to make timely decision
- Highly motivated with the ability to prioritize, perform under pressure, and get team members and stakeholders involved and to motivate them
- Ability to collaborate and work as a team with various stakeholders and partners in multi-site/multi-cultural teams
- Strong in communication and people interpersonal skills across all levels. Experience in Subcon management
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Senior Staff Specialist Package Technology Development Arbeitgeber: Infineon Technologies Austria AG
Infineon ist ein hervorragender Arbeitgeber, der seinen Mitarbeitern eine dynamische und unterstützende Arbeitsumgebung bietet, in der Innovation und Zusammenarbeit gefördert werden. Mit einem klaren Fokus auf Vielfalt und Inklusion sowie umfangreichen Möglichkeiten zur beruflichen Weiterentwicklung, profitieren Mitarbeiter von einem inspirierenden Umfeld, das sowohl persönliche als auch berufliche Ziele unterstützt. Darüber hinaus ermöglicht die Lage in einem technologisch fortschrittlichen Umfeld den Zugang zu erstklassigen Ressourcen und Netzwerken, die für die Entwicklung neuer Technologien entscheidend sind.
Kontaktdaten:
Infineon Technologies Austria AG Recruiting-Team
StudySmarter Expertenrat🤫
Wir sind der Meinung, dass Sie so Senior Staff Specialist Package Technology Development erhalten könnten
✨Tip Number 1
Familiarize yourself with the latest trends and technologies in package development, especially in areas like Wafer Level Packaging (WLP) and System in Package (SiP). This knowledge will not only help you during interviews but also demonstrate your commitment to staying updated in this fast-paced field.
✨Tip Number 2
Network with professionals in the semiconductor industry, particularly those involved in OSAT and package technology. Attend relevant conferences or webinars to connect with potential colleagues and learn more about the challenges and innovations in the field.
✨Tip Number 3
Prepare to discuss specific examples from your past experience that showcase your problem-solving skills and ability to manage projects effectively. Highlight instances where you successfully optimized processes or improved product quality, as these are key aspects of the role.
✨Tip Number 4
Demonstrate your understanding of quality requirements and release criteria relevant to package design. Be ready to explain how you have applied these standards in previous roles, as this will show your alignment with Infineon's commitment to high-quality products.
Wir glauben, dass du diese Fähigkeiten brauchst, um Senior Staff Specialist Package Technology Development mit Bravour zu bestehen
Einige Tipps für deine Bewerbung 🫡
Understand the Role:Make sure to thoroughly read the job description for the Senior Staff Specialist Package Technology Development position. Understand the key responsibilities and required qualifications, as this will help you tailor your application.
Highlight Relevant Experience:In your CV and cover letter, emphasize your experience in package development, project management, and any specific technologies mentioned, such as Module assembly or System in Package (SiP). Use concrete examples to demonstrate your skills.
Showcase Analytical Skills:Since strong analytical skills are crucial for this role, include examples of how you've successfully solved complex problems in previous positions. This could involve process optimization or risk assessment tasks.
Communicate Effectively:Given the importance of communication and interpersonal skills, ensure that your application reflects your ability to work collaboratively across different functions. Mention any relevant experiences where you successfully managed teams or projects.
Wie man sich auf ein Vorstellungsgespräch bei Infineon Technologies Austria AG vorbereitet
✨Understand Package Technology
Make sure you have a solid grasp of package development processes, especially in areas like Module assembly and Wafer level packages. Be prepared to discuss your experience with these technologies and how they relate to the role.
✨Showcase Project Management Skills
Highlight your project management experience, particularly in managing complex projects. Be ready to provide examples of how you've successfully led or supported project initiatives in the past.
✨Demonstrate Analytical and Problem-Solving Abilities
Prepare to discuss specific instances where you've used your analytical skills to solve problems or improve processes. This could include examples of conflict resolution or quality improvement initiatives.
✨Communicate Effectively
Since strong communication skills are essential for this role, practice articulating your thoughts clearly and confidently. Be ready to engage in discussions about cross-functional collaboration and how you've worked with diverse teams.
