Overview
In this role you will define and drive CPB design methodologies and digital engineering capabilities, partnering with business lines and engineering communities to align with product roadmaps. You will translate needs into improved flows, simulation and automation concepts, and guide EDA roadmap decisions. You’ll lead continuous improvement of CPB methodologies to accelerate convergence and quality, while shaping future capabilities for advanced packaging and AI-enabled workflows. This is a hands-on, cross-functional leadership role with a strong impact on the company’s technology strategy and execution.
Leistungen / Benefits
- competitive salary
- equal opportunities
- diversity and inclusion
- trusting work environment
- career growth opportunities
- opportunity to influence cutting-edge technology
Verantwortungsbereiche
- Define and drive the CPB design methodology roadmap, flows, tools, and digital engineering capabilities
- Collaborate with Business Lines, Design Centers, and engineering communities to capture product requirements and trends
- Translate needs into methodology enhancements, flow improvements, simulations, automation concepts, and EDA roadmap inputs
- Serve as technical bridge between Business Lines, methodology teams, software, IT, and EDA vendors
- Improve CPB methodologies and workflows to speed convergence, quality, and first-pass success
- Establish scalable, reusable methodology solutions, standards, and governance
- Identify and shape capabilities for advanced packaging, SiP, 3D design, multi-domain simulation, and AI-assisted workflows
- Evaluate EDA technologies and industry trends to align with future business needs
- Lead AI, automation, data, and digitalization initiatives toward integrated, data-driven CPB co-design
- Provide technical leadership, training, and enablement for global user communities and stakeholders
- Foster partnerships across engineering functions and drive adoption of methodology and digital engineering solutions
Zentrale Anforderungen
- Bachelor in Electrical Engineering, Microelectronics, Physics, Computer Engineering, or related technical discipline
- min 8 years in semiconductor development, design methodologies, EDA environments, package development, design automation, or related fields
- deep understanding of chip, package, board, simulation, and system-level interactions
- ability to translate business challenges and roadmaps into methodology strategies
- proven track record in defining and deploying engineering methodologies and flows
- strong analytical and strategic thinking for future-proofing technology
- experience with EDA vendors (Cadence, Synopsys, Keysight, Comsol); knowledge of digitalization and AI-enabled workflows
- customer-oriented mindset with balance of operational excellence and long-term strategy
- excellent communication, stakeholder management, and influencing skills
- ability to act as trusted technical partner for Business Lines; strong business awareness
- English fluent; German a plus
- communication
- stakeholder management
- influencing
- Cadence, Synopsys, Keysight, Comsol (EDA tools)
- AI-enabled engineering workflows
- data-driven engineering
Senior Staff Engineer Chip Package Board - CoDesign Flow and Methodology (f/m/div) in Villach Arbeitgeber: Infineon Technologies
Infineon Technologies Bipolar GmbH & Co. KG ist ein hervorragender Arbeitgeber, der seinen Mitarbeitern nicht nur die Möglichkeit bietet, an innovativen Projekten im Bereich IT PLM und MDM zu arbeiten, sondern auch ein unterstützendes und inklusives Arbeitsumfeld fördert. Mit einem klaren Fokus auf persönliche Entwicklung und Karrierewachstum, sowie einer Unternehmenskultur, die Vielfalt und Chancengleichheit schätzt, sind wir bestrebt, das beste Infineon für alle zu schaffen und gleichzeitig die Herausforderungen von morgen zu meistern.
