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- Aufgaben: Lead innovative packaging technology projects for cutting-edge power modules.
- Arbeitgeber: Join Li Auto, a pioneer in smart electric vehicles and power semiconductor innovation.
- Mitarbeitervorteile: Be part of a dynamic team with opportunities for collaboration and growth.
- Warum dieser Job: Make a significant impact in the exciting field of power semiconductors and automotive technology.
- Gewünschte Qualifikationen: Bachelor's degree in relevant fields and 8+ years in power semiconductor development required.
- Andere Informationen: Work with top industry experts and engage in technical cooperation with universities.
Das voraussichtliche Gehalt liegt zwischen 72000 - 84000 € pro Jahr.
Job Description
About us About Li Auto: We're a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide families with safer, more comfortable, and more convenient products and services. Our power module team is one of the leading teams in the power semiconductor industry, known for its exceptional capabilities and expertise in the power semiconductor field.
With a strong focus on innovation and cutting-edge research, we have established ourselves as pioneers in the area of automotive grade SiC device packaging and application. Join our team and be part of an exciting journey where you can make a significant impact in the field of power semiconductors. Duties and responsibilities Track industry technology trends and develop packaging technology roadmaps for power modules; Leading the team to complete the pre-research of advanced packaging solutions, and organize technical cooperation with universities and research institutes; Leading team to complete the technical development of advanced power module, output design and process files; Support product development team to finish product development and import to factory for mass production.
Requirements Education/Experience Bachelor degree or above in microelectronics, materials engineering, power electronics, mechanical electronics or other related majors. More than 8 years of experience in power semiconductor packaging product development or technology research and development. Knowledge Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry.
Possess a solid theoretical foundation for the microstructure, basic working principles, common failure modes and power electronic circuits of power semiconductor devices such as Si, SiC and GaN. Profound knowledge of packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect. Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in the industry.
Familiar with power module design rules as well as simulation or structure design tools. Good command of English written and oral communication skills.
Design professional (m/w/d) Arbeitgeber: Li Auto
Kontaktperson:
Li Auto HR Team
StudySmarter Bewerbungstipps 🤫
So bekommst du den Job: Design professional (m/w/d)
✨Tip Number 1
Stay updated on the latest trends in power semiconductor packaging. Follow industry publications, attend webinars, and participate in relevant forums to deepen your understanding and showcase your knowledge during interviews.
✨Tip Number 2
Network with professionals in the semiconductor industry. Attend conferences or local meetups to connect with potential colleagues and mentors who can provide insights and possibly refer you to opportunities at Li Auto.
✨Tip Number 3
Prepare to discuss specific projects you've worked on that relate to power module design and packaging. Be ready to explain your role, the challenges faced, and how you contributed to successful outcomes.
✨Tip Number 4
Familiarize yourself with Li Auto's products and innovations. Understanding their approach to electric vehicles and power semiconductors will help you align your skills and experiences with their goals during discussions.
Diese Fähigkeiten machen dich zur top Bewerber*in für die Stelle: Design professional (m/w/d)
Tipps für deine Bewerbung 🫡
Understand the Company: Familiarize yourself with Li Auto's mission and values. Highlight how your experience aligns with their focus on innovation in the power semiconductor industry.
Tailor Your CV: Customize your CV to emphasize your relevant experience in power semiconductor packaging and product development. Make sure to include specific projects or achievements that demonstrate your expertise.
Craft a Compelling Cover Letter: Write a cover letter that showcases your passion for the automotive industry and your understanding of advanced packaging solutions. Mention any collaborations with universities or research institutes that relate to the role.
Highlight Technical Skills: Clearly outline your technical skills related to semiconductor packaging, including knowledge of design rules and simulation tools. Use specific examples to illustrate your proficiency in these areas.
Wie du dich auf ein Vorstellungsgespräch bei Li Auto vorbereitest
✨Showcase Your Technical Expertise
Be prepared to discuss your experience in power semiconductor packaging and product development. Highlight specific projects where you led technical developments or collaborated with universities and research institutes.
✨Demonstrate Industry Knowledge
Familiarize yourself with the latest trends in the semiconductor packaging industry. Discuss how these trends can influence the design and development of power modules, showcasing your understanding of the market.
✨Highlight Interpersonal Skills
Since good interpersonal relationships are crucial in this role, be ready to share examples of how you've successfully collaborated with teams or built partnerships within the industry.
✨Prepare for Technical Questions
Expect questions related to microstructure, failure modes, and design principles of power semiconductor devices. Brush up on your knowledge of Si, SiC, and GaN technologies to confidently answer these queries.