Power Electronics Hardware Intern in München

Our Semiconductor Advanced Research team develops next-generation semiconductor, packaging, and application technologies for electric vehicle and embodied AI products. We combine system-level design, advanced packaging, simulation, testing, and failure analysis to transform early-stage concepts into validated demonstrators.

We are looking for a hands-on, self-driven engineer with strong expertise in power or MEMS semiconductor modules, packaging technologies, and electro-thermal-mechanical co-design. You will work in a cross-functional and international team to develop, validate, and continuously improve advanced semiconductor-module solutions.

Duties and responsibilities:

• Support the design and development of power semiconductor modules and related mechanical or electrical components.
• Create and update 3D component and assembly models, drawings, and technical documentation using CAD tools.
• Support definition and documentation of module-level bills of materials, including substrates, copper materials, bonding wires, packaging materials, and other relevant components.
• Work with electrical, thermal, mechanical, and simulation engineers to evaluate and improve module design concepts.
• Prepare, assemble, and support testing of power-electronics components and semiconductor-module demonstrators.
• Assist with electrical, thermal, and functional testing, including test setup preparation, data collection, analysis, and reporting.
• Support reliability-test and failure-analysis activities; document observations and help track follow-up actions.
• Conduct structured technology scouting and benchmarking of relevant power-semiconductor, packaging, and application technologies.
• Support the team in building functional demonstrators and maintaining clear technical documentation.

Requirements:

Education/Experience

• Currently pursuing a Master's degree or PhD in power electronics, microelectronics, electrical engineering, mechanical engineering, thermal engineering, materials science, or a related discipline.
• Basic theoretical knowledge of power electronics, semiconductor devices, power modules, or electronic packaging.
• Initial hands-on experience-through coursework, research, projects, or internships-in electrical, mechanical, or electronic-component design is desirable.
• Interest in power-semiconductor-module testing, characterization, thermal management, and reliability.
• Familiarity with PCB-design tools such as Altium Designer or Cadence is an advantage.
• Familiarity with 3D CAD tools such as CATIA or SolidWorks is preferred.
• Experience with laboratory equipment, test automation, data analysis, or programming tools such as Python or MATLAB is a plus.
• A solution-oriented and hands-on mindset, with the willingness to learn quickly and turn technical questions into structured next steps.
• Well organized, detail-oriented, and comfortable working in a fast-moving research and development environment.
• Self-motivated, reliable, and proactive in identifying gaps, asking the right questions, and following tasks through to completion.
• Professional fluency in spoken and written English; Chinese or German is a plus.

About Li Auto:

Li Auto is a leading Chinese new-energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles. Through product, technology, and business-model innovation, we create safer, more comfortable, and more convenient mobility experiences for families.

What we offer:

• Practical experience in advanced power-semiconductor and packaging development.
• Exposure to module design, simulation, prototype development, testing, and failure-analysis workflows.
• Mentorship and collaboration with experts in power electronics, thermal engineering, mechanics, and semiconductor packaging.
• A modern working environment in Munich and a multicultural, entrepreneurial team.
• The opportunity to make a visible contribution to early-stage technology development for next-generation EV products.