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- Aufgaben: Lead innovative power module packaging design and collaborate with top universities.
- Arbeitgeber: Join Li Auto, a pioneer in smart electric vehicles and cutting-edge technology.
- Mitarbeitervorteile: Be part of a dynamic team with opportunities for growth and innovation.
- Warum dieser Job: Make a significant impact in the power semiconductor field while working on groundbreaking projects.
- Gewünschte Qualifikationen: Bachelor's degree in relevant fields and 8+ years in power semiconductor packaging required.
- Andere Informationen: Ideal for passionate engineers eager to push boundaries in technology.
Das voraussichtliche Gehalt liegt zwischen 72000 - 84000 € pro Jahr.
About us About Li Auto: We’re a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide families with safer, more comfortable, and more convenient products and services. About the team: Our power module team is one of the leading teams in the power semiconductor industry, known for its exceptional capabilities and expertise in the power semiconductor field. With a strong focus on innovation and cutting-edge research, we have established ourselves as pioneers in the area of automotive grade Si C device packaging and application. We welcome candidates who are passionate about pushing the boundaries of power module packaging and are eager to contribute to our team’s pioneering work. Join our team and be part of an exciting journey where you can make a significant impact in the field of power semiconductors. Duties and responsibilities Track industry technology trends and develop packaging technology roadmaps for power modules; Responsible for power module product definition, develop power module product roadmap; Leading the team to complete the pre-research of advanced packaging solutions, and organize technical cooperation with universities and research institutes; Leading team to complete the technical development of advanced power module, output design and process files; Support product development team to finish product development and import to factory for mass production. Requirements Education/Experience Bachelor degree or above in microelectronics, materials engineering, power electronics, mechanical electronics or other related majors. More than 8 years of experience in power semiconductor packaging product development or technology research and development. Experience in industry-leading product development and mass production is preferred. Have successful experience in Si C module development, and those who develop products to achieve mass production status are preferred. Knowledge Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry. Possess a solid theoretical foundation for the microstructure, basic working principles, common failure modes and power electronic circuits of power semiconductor devices such as Si, Si C and Ga N. Profound knowledge of packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect. Skills and Competencies Passionate about engineering, with a strong spirit of innovation. Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in the industry. Familiar with power module design rules as well as simulation or structure design tools. Proactive, with pioneering spirit and a good sense of internal and external client. Good command of English written and oral communication skills. Contact HR: Penny Email:
Power module packaging design expert Arbeitgeber: Li Auto
Kontaktperson:
Li Auto HR Team
StudySmarter Bewerbungstipps 🤫
So bekommst du den Job: Power module packaging design expert
✨Tip Number 1
Stay updated on the latest trends in power semiconductor packaging. Follow industry publications, attend webinars, and participate in relevant forums to demonstrate your knowledge during interviews.
✨Tip Number 2
Network with professionals in the semiconductor industry. Attend conferences or local meetups to connect with potential colleagues and learn about opportunities that may not be advertised.
✨Tip Number 3
Showcase your experience with SiC module development. Prepare specific examples of past projects where you successfully led product development or achieved mass production status.
✨Tip Number 4
Highlight your passion for innovation in engineering. Be ready to discuss how you've contributed to cutting-edge research or advanced packaging solutions in previous roles.
Diese Fähigkeiten machen dich zur top Bewerber*in für die Stelle: Power module packaging design expert
Tipps für deine Bewerbung 🫡
Understand the Company: Before applying, take some time to understand Li Auto's mission and values. Familiarize yourself with their innovations in the electric vehicle sector and how your expertise in power module packaging can align with their goals.
Tailor Your CV: Make sure your CV highlights your relevant experience in power semiconductor packaging and product development. Emphasize any successful projects related to Si C module development and mass production that demonstrate your capabilities.
Craft a Compelling Cover Letter: Write a cover letter that showcases your passion for engineering and innovation. Discuss specific experiences that relate to the duties mentioned in the job description, such as leading technical developments or collaborating with research institutions.
Highlight Relevant Skills: In your application, clearly outline your knowledge of semiconductor packaging, thermal design, and electrical design. Mention any tools you are familiar with and how they have contributed to your past successes in the industry.
Wie du dich auf ein Vorstellungsgespräch bei Li Auto vorbereitest
✨Show Your Passion for Innovation
Make sure to express your enthusiasm for engineering and innovation during the interview. Share specific examples of how you've pushed boundaries in your previous roles, especially in power module packaging or semiconductor development.
✨Demonstrate Industry Knowledge
Be prepared to discuss current trends in the semiconductor packaging industry. Highlight your understanding of Si C and Ga N technologies, and how they relate to the company's goals. This will show that you are not only knowledgeable but also genuinely interested in the field.
✨Highlight Your Technical Expertise
Discuss your experience with packaging system design, thermal design, and reliability design. Provide concrete examples of projects where you led technical developments or collaborated with universities and research institutes, showcasing your leadership skills.
✨Communicate Effectively
Since good command of English is required, practice articulating your thoughts clearly and concisely. Prepare to explain complex technical concepts in a way that is easy to understand, as this will demonstrate your communication skills and ability to work with diverse teams.
