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- Aufgaben: Lead the development of advanced power module processes and support product development for mass production.
- Arbeitgeber: Li Auto is a top Chinese EV company focused on innovative smart electric vehicles.
- Mitarbeitervorteile: Join a pioneering team in the power semiconductor industry with opportunities for innovation and collaboration.
- Warum dieser Job: Make a significant impact in automotive technology while working with cutting-edge research and a passionate team.
- Gewünschte Qualifikationen: Bachelor's degree in relevant fields and 8+ years in power semiconductor packaging or R&D required.
- Andere Informationen: Proficiency in English and strong teamwork skills are essential.
Das voraussichtliche Gehalt liegt zwischen 72000 - 100000 € pro Jahr.
About us About Li Auto: We’re a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs).
Through product, technology, and business model innovations, we provide families with safer, more comfortable, and more convenient products and services.
About the team： Our power module team is one of the leading teams in the power semiconductor industry, known for its exceptional capabilities and expertise in the power semiconductor field.
With a strong focus on innovation and cutting-edge research, we have established ourselves as pioneers in the area of automotive grade Si C device packaging and application.
We welcome candidates who are passionate about pushing the boundaries of power module packaging and are eager to contribute to our team’s pioneering work.
Join our team and be part of an exciting journey where you can make a significant impact in the field of power semiconductors.
Duties and responsibilities Tracking Si C power module technology trends, defining power module process technology roadmap; Leading team to complete pre-research of advanced process technologies, organize technical cooperation with universities and research institutes; Leading team to develop advanced power module processes, output process files; Support product development team to finish product development and import to factory for mass production; Support mass production process teams to solve major process issues, improve reliability and yield.
Requirements Education/Experience Bachelor degree or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields; More than 8 years of experience in power semiconductor packaging product development or technology research and development; Experience in industry-leading product development and mass production is preferred; Proficient in packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect; Have successful experience in Si C module development, and those who develop products to achieve mass production status are preferred; Knowledge Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry; Profound knowledge of key packaging processes & corresponding equipment, e.g.
Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.
Skills and Competencies Proactive, with pioneering spirit and a good sense of internal and external client; Passionate about engineering, with a strong spirit of innovation; Good command of English written and oral communication skillsï¼› Excellent team coordination and communication skills.
Contact HR: Penny Email:
Power module process expert Arbeitgeber: Li Auto
Kontaktperson:
Li Auto HR Team
StudySmarter Bewerbungstipps 🤫
So bekommst du den Job: Power module process expert
✨Tip Number 1
Familiarize yourself with the latest trends in SiC power module technology. Follow industry publications and attend relevant webinars or conferences to stay updated. This knowledge will not only help you during interviews but also demonstrate your passion for the field.
✨Tip Number 2
Network with professionals in the semiconductor packaging industry. Use platforms like LinkedIn to connect with current employees at Li Auto or similar companies. Engaging in conversations can provide insights into the company culture and potentially lead to referrals.
✨Tip Number 3
Prepare to discuss your experience with advanced power module processes in detail. Be ready to share specific examples of how you've contributed to product development and mass production, as this aligns closely with the responsibilities of the role.
✨Tip Number 4
Showcase your proactive approach and innovative spirit during the interview. Think of examples where you've led projects or solved complex problems in previous roles, as these qualities are highly valued by Li Auto.
Diese Fähigkeiten machen dich zur top Bewerber*in für die Stelle: Power module process expert
Tipps für deine Bewerbung 🫡
Understand the Company: Familiarize yourself with Li Auto's mission and values. Highlight your passion for new energy vehicles and how your background aligns with their innovative approach in the power semiconductor industry.
Tailor Your CV: Customize your CV to emphasize your experience in power semiconductor packaging and product development. Make sure to include specific projects or achievements that demonstrate your expertise in SiC module development.
Craft a Compelling Cover Letter: Write a cover letter that showcases your enthusiasm for the role and the company. Discuss your relevant experience, particularly in leading teams and developing advanced processes, and how you can contribute to Li Auto's goals.
Highlight Relevant Skills: In your application, clearly outline your skills in packaging system design, thermal design, and reliability design. Mention any successful experiences in mass production and your knowledge of key packaging processes and equipment.
Wie du dich auf ein Vorstellungsgespräch bei Li Auto vorbereitest
✨Show Your Passion for Innovation
Make sure to express your enthusiasm for engineering and innovation during the interview. Share specific examples of how you've pushed boundaries in your previous roles, especially in power module packaging or semiconductor technology.
✨Demonstrate Technical Expertise
Be prepared to discuss your experience with key packaging processes and equipment, such as Die Attach and Wire Bonding. Highlight any successful projects where you contributed to product development or mass production, particularly in Si C modules.
✨Highlight Collaboration Skills
Since teamwork is crucial in this role, share instances where you've effectively collaborated with cross-functional teams or external partners, like universities or research institutes. Emphasize your communication skills and ability to coordinate efforts.
✨Stay Updated on Industry Trends
Research current trends in the power semiconductor industry before the interview. Being knowledgeable about recent advancements will demonstrate your commitment to the field and your proactive approach to staying informed.
