Scientist - Package Design Engineer
SAL - Silicon Austria Labs Villach, Austria From € 65.000 per year gross Your future tasks include:
Research and development of advanced packaging platforms (2.5D and 3D). Design and fabrication of Si/RDL interposers for photonic-electronic integration. Development of assembly design kits (ADK). Process development and integration of TSV fabrication into interposer platforms. Data analysis, modeling, and process optimization. Lead and contribute to research projects, including publishing high-quality scientific papers or patents. Technical project management, acquisition in collaboration with scientific and industrial partners and coordination of development activities. Preparation of technical reports, scientific publications, and presentations. Preparation and submission of research funding proposals. Your profile:
MSc or PhD in Electrical Engineering or a related field. Strong expertise in WLCSP design and IC–Package–PCB co-design. Hands-on experience in cleanroom processing and microfabrication workflows. Proven expertise in silicon or RDL interposer design and fabrication for 2.5D integration. Solid understanding of, and practical experience in, TSV/TGV processing. Experience in photonic packaging and co-packaged optics integration is highly desirable. Familiarity with passive and active optical alignment techniques. Knowledge of heterogeneous integration, chiplets and advanced packaging concepts. Experience of working with photonic assemblies and optical testing/characterisation. Strong analytical skills and a structured approach to problem solving. Experience in collaborative R&D projects and proposal writing. Fluency in English; German is a plus.
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SAL - Silicon Austria Labs Recruiting-Team
