Your Tasks:
As part of the automation team, you will support in optimizing software-controlled production processes and work on transferring existing processes to new technologies:
- Deployment of wafer map merge software to new technologies
- Gap analysis: production requirements and software capabilities
- Extension and error proofing of existing software code
- Close collaboration with test & assembly
What your background should look like:
- Studying in the field of computer science, business informatics, or a comparable course of study
- Experience in semiconductor fabrication processes or experience through internships, student work, or project/bachelor’s/master’s work in cooperation with companies would be desirable
- Advanced knowledge of C#, knowledge of SQL, knowledge of LabView would be an advantage
- You enjoy working in a team, are creative and want to contribute your own ideas. You are motivated by challenges, and you like to familiarize yourself quickly with new tools and processes
- C1 level in English or German (written & spoken)
Competencies
Values: Integrity, Accountability, Inclusion, Innovation, Teamwork
ABOUT TE CONNECTIVITY
TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, renewable energy, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 8,000 engineers, working alongside customers in approximately 140 countries. TE ensures that EVERY CONNECTION COUNTS.
Kontaktperson:
TE Connectivity Solutions GmbH HR Team
