IC Assembly Engineer

Social network you want to login/join with: Client: Location: Job Category: – Job Reference: de54def7b111 Job Views: 4 Posted: 03.03.2025 Expiry Date: 17.04.2025 Job Description: In order to strengthen our IC Production Backend division, we are recruiting a IC Assembly Engineer . You will be responsible for subcontracted processes into our Outsourced Semiconductor Assembly & test houses in Asia (OSAT) processing various types of bumping. Your responsibility covers New Products Introductions (NPI) process from feasibility to full deployment into operations. You will manage internal & external changes proposals coming from our OSATs. Your mission extends to innovation from existing and new OSATS including internal communication and process internalization. As project leader, you drive equipment acquisition from suppliers selection to full deployment in production. As Process engineer, you will be responsible for specific processes in our preassembly site such as Automated Optical Inspection (AOI) & Die sorting. Your assignment includes: Interface with development team and drive to optimized assembly cost / lead time solutions. New Products deployments on Automated Optical Inspection (AOI) including production monitoring. Interface with preassembly team and report potential internalization and lessons learned from OSAT experience. Engineering ramp up support in internal and external production activity. You will be a leader in cross-functional problem-solving teams for quality and technical related problems. You will work closely with the Development teams, Engineering, Maintenance, Logistics, and Operations in a highly multicultural environment. As a technical leader of cross-functional teams, documentation and presentation of your work results according to EM’s business processes will be an important part of your responsibility. This position offers various and wide responsibilities on both an operational and project-driven level. #J-18808-Ljbffr